Facility and Production Capacity
| Shiga Factory | Build-up PCB | 20,000m2 / Month |
|---|---|---|
| Multi-layer PCB | 85,000m2 / Month | |
| Double-sided through-hole PCB | 30,000m2 / Month | |
| ELNA PCB (Malaysia) Sdn. Bhd. | Multi-layer PCB | 30,000m2 / Month |
| Double-sided through-hole PCB | 20,000m2 / Month |
Etching Equipment
Makes possible high quality circuit forming Fine line L/S = 75/75µm - 50/50µm mass production etching with the greater consistency required for impedance control.
Solder Resist Equipment
Mini VIA eliminates ink blockages.
Achieves high-precision image alignment.
Multi-stage press
Latest equipment introduced to handle impedance control
