From Design, Trial to Mass Production of Capacitor and PC Board, We will supply Electronic Device all over the world

Approach

Rapid Design and Prototype

Our development engineers all offer assistance to your company with prompt support.

We share the benefit of our experience by making suggestions for optimizing mass production.

To top of this page

Environmental Issues

Use of Halogen-free Materials
We currently have in mass production a punching process using a metal die for multilayer PWBs (ELBit).
A Shift to Water-soluble Flux
We have achieved solder wetting and solder wicking on par with rosin preflux.

To top of this page

The Business Obtained International Quality Certifications

  Saga Business Unit Elna Matsumoto ELNA PCB (M)
ISO14001 Awarded in 2001 Awarded in 2002 Awarded in 1998
ISO9001 Awarded in 1994 -- --
ISO9002 -- Awarded in 2000 Awarded in 1998

To top of this page

Technology Development

Miniaturization
  • The deployment of new etching equipment has made even higher circuit densities possible.
    Specifications: L/S 75/75µm to 50/50µm compatible.
  • The deployment of new photoresist equipment has made it possible to handle smaller components for mounting on circuit boards.
    Chip components: 1005 to 0804 component-compatible.
Lighter/Higher Density
  • The buildup manufacturing line is fully under way (bump fabrication method; EL Bit)
  • The combination processing method (which combines laser beam machining) is currently under development.

To top of this page

Cost Reductions

Addressed in the Circuit Fabrication Process
Planning on deploying a dip coater as a way to eliminate dry resist.

To top of this page