Construction (Combination Type)
Process
Features
- Stack-via structures is available.
- Higher density assembly is available by means of fine patterning technologies.
- The prepreg reinforced glass woven cloth is available for build-up layers. And it improves strength of bending test and drop impact test.
- Not only FR-4 material most conventional CCLs and prepreg are applied for this build-up PWBs.
Applications
- Mobile telephone, Digital still camera, etc
Standard Specification
| Items | Standard spec. | ||
|---|---|---|---|
| External layers | Min. conductor width | 0.075mm | |
| Min. spacing of conductors | 0.075mm | ||
| Internal layers | Min. conductor width | 0.1mm (0.075) | |
| Min. spacing of conductors | 0.1mm (0.075) | ||
| Copper thickness of external layer | 18µm | ||
| Copper thickness of internal layer | 35µm | ||
| Thickness of through hole plating (Combination Type) |
IVH | 15µm | |
| TH | 20µm | ||
| Via | Smallest land diameter of external layer | Laser | φ0.275 (φ0.25) |
| Bump | φ0.3 (φ0.275) | ||
| TH | φ0.6 | ||
| Smallest land diameter of internal layer | Laser | φ0.275 (φ0.25) | |
| Bump | φ0.3 (φ0.275) | ||
| IVH | φ0.5 | ||
| Smallest hole diameter | Laser | φ0.1 | |
| IVH | φ0.2 | ||
| PTH | φ0.25 | ||
| Number of layer | 4. 6. 8 | ||
