From Design, Trial to Mass Production of Capacitor and PC Board, We will supply Electronic Device all over the world



Construction (Combination Type)

Process

Features

  • Stack-via structures is available.
  • Higher density assembly is available by means of fine patterning technologies.
  • The prepreg reinforced glass woven cloth is available for build-up layers. And it improves strength of bending test and drop impact test.
  • Not only FR-4 material most conventional CCLs and prepreg are applied for this build-up PWBs.

Applications

  • Mobile telephone, Digital still camera, etc

Standard Specification

Items Standard spec.
External layers Min. conductor width 0.075mm
Min. spacing of conductors 0.075mm
Internal layers Min. conductor width 0.1mm (0.075)
Min. spacing of conductors 0.1mm (0.075)
Copper thickness of external layer 18µm
Copper thickness of internal layer 35µm
Thickness of through hole plating
(Combination Type)
IVH 15µm
TH 20µm
Via Smallest land diameter of external layer Laser φ0.275 (φ0.25)
Bump φ0.3 (φ0.275)
TH φ0.6
Smallest land diameter of internal layer Laser φ0.275 (φ0.25)
Bump φ0.3 (φ0.275)
IVH φ0.5
Smallest hole diameter Laser φ0.1
IVH φ0.2
PTH φ0.25
Number of layer 4. 6. 8

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