Overview
The multilayer printed wiring board (blind via hole) uses electrical connections between conductors that do not pass all the way through the multilayer printed wiring board (i.e., via holes).
Structure
Features
- Components can be mounted over via holes.
- The circuit board can be made smaller.
- High-density interconnects are possible.
- Interconnects can be made shorter.
Applications
- Portable telephones/portable data terminals, portable music devices, in-vehicle audiovisual equipment, camcorders.
Specifications
| Items | Standard specification | ||
|---|---|---|---|
| External layer | Min. Conductor width | 0.1mm (0.075) | |
| Min. Spacing of conductor | 0.1mm (0.075) | ||
| Internal layer | Min. Conductor width | 0.1mm | |
| Min. Spacing of conductor | 0.1mm | ||
| Conductor thickness of external layer | 18µm (35) | ||
| Conductor thickness of internal layer | 35µm (18) | ||
| Plating thickness of through hole (Combination Type) | IVH | 15µm | |
| TH | 15µm | ||
| Via | Smallest land diameter of external layer | Bump | φ0.4mm |
| TH | φ0.5mm | ||
| Smallest land diameter of internal layer | Bump | φ0.4mm | |
| TH | φ0.5mm | ||
| Smallest hole diameter | IVH | φ0.2mm | |
| TH | φ0.25mm | ||
| Number of layer | 4, 6, 8 | ||
* Please inquire separately regarding fine specifications and special specifications.
