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Overview

The multilayer printed wiring board (blind via hole) uses electrical connections between conductors that do not pass all the way through the multilayer printed wiring board (i.e., via holes).

Structure

Features

  • Components can be mounted over via holes.
  • The circuit board can be made smaller.
  • High-density interconnects are possible.
  • Interconnects can be made shorter.

Applications

  • Portable telephones/portable data terminals, portable music devices, in-vehicle audiovisual equipment, camcorders.

Specifications

Items Standard specification
External layer Min. Conductor width 0.1mm (0.075)
Min. Spacing of conductor 0.1mm (0.075)
Internal layer Min. Conductor width 0.1mm
Min. Spacing of conductor 0.1mm
Conductor thickness of external layer 18µm (35)
Conductor thickness of internal layer 35µm (18)
Plating thickness of through hole (Combination Type) IVH 15µm
TH 15µm
Via Smallest land diameter of external layer Bump φ0.4mm
TH φ0.5mm
Smallest land diameter of internal layer Bump φ0.4mm
TH φ0.5mm
Smallest hole diameter IVH φ0.2mm
TH φ0.25mm
Number of layer 4, 6, 8

* Please inquire separately regarding fine specifications and special specifications.

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