Overview
Bump Printing
Cross Section After Contact
View of bump after printing
View of contact between layers
Process
Features
- Pad-on-via structure becomes easy.
- The glass fiber yarn in the build-up layers and the use of prepreg provides superior bending strength and shock strength.
- The drilling processes and plating processing can be reduced, with major benefits in terms of environmental friendliness.
- The fine patterns provide increased density.
- Compatible with resin materials with the exception of FR-4 substrate materials.
Applications
- Portable telephones/portable data terminals, digital cameras, IC cards, camera modules, etc.
Standard Specifications
| Items | Standard specification | ||
|---|---|---|---|
| External layer | Min. Conductor width | 0.1mm (0.075) | |
| Min. Spacing of conductor | 0.1mm (0.075) | ||
| Internal layer | Min. Conductor width | 0.1mm | |
| Min. Spacing of conductor | 0.1mm | ||
| Conductor thickness of external layer | 18µm (35) | ||
| Conductor thickness of internal layer | 35µm (18) | ||
| Plating thickness of through hole (Combination Type) | IVH | 15µm | |
| TH | 15µm | ||
| Via | Smallest land diameter of external layer | Bump | φ0.3mm (0.275) |
| TH | φ0.5mm | ||
| Smallest land diameter of internal layer | Bump | φ0.3mm (0.275) | |
| TH | φ0.5mm | ||
| Smallest hole diameter | IVH | φ0.2mm | |
| TH | φ0.25mm | ||
| Number of layer | 4, 6, 8 | ||
New Technologies
Stack via
Layout
Laser via + B2it
Etched-bump + B2it
* Please inquire separately regarding fine specifications and special specifications.
