Construction
Process
Features
- FTH technology offers the advantages to higher density wiring.
- It's available to locate SMD pads on the paste plugging via holes.
- It's possible to change blind via holes into plated through holes and to improve cost/performance.
- It's available to prevent the solder paste flows into adjacent holes and the corrosive contamination in holes.
Applications
- Mobile telephone, VTR-Camera etc
Standard Specification
| Items | Standard Spec. | |||
|---|---|---|---|---|
| External layers | Min. conductor width | 0.1mm | ||
| Min. spacing of conductors | 0.1mm | |||
| Internal layers | Min. conductor width | 0.1mm | ||
| Min. spacing of conductors | 0.1mm | |||
| Conductor thickness of external layer | 35µm≦ | |||
| Conductor thickness of internal layer | 12, 18, 35µm | |||
| Plating thickness of through hole (Thickness of PWB) |
10µm≦ 0.4 - 0.6t |
15µm≦ 0.8 - 1.2t |
20µm≦ 1.2 - 1.6t |
|
| The smallest hole diameter of FTH | φ0.2≦ 0.4 - 0.6t |
φ0.25≦ 0.8 - 1.2t |
φ0.3≦ 1.2 - 1.6t |
|
| The smallest space between walls of adjacent holes | FTH - FTH : 0.4mm≦ FTH - PTH : 0.8mm≦ |
|||
| Number of layers | 2, 4, 6, 8 | |||
| Thickness of PWB | 0.4 - 1.6mm | |||
