From Design, Trial to Mass Production of Capacitor and PC Board, We will supply Electronic Device all over the world



Construction

Process

Features

  • FPH technology offers the advantages to higher density wiring.
  • It's available to locate SMD pads on the paste plugging via holes.
  • It's possible to change blind via holes into plated through holes and to improve cost/performance.
  • It's available to prevent the solder paste flows into adjacent holes and the corrosive contamination in holes.

Applications

  • Mobile telephone, VTR-Camera etc

Standard Specification

Items Standard Spec.
External layers Min. conductor width 0.1mm
Min. spacing of conductors 0.1mm
Internal layers Min. conductor width 0.1mm
Min. spacing of conductors 0.1mm
Conductor thickness of external layer 35µm≦
Conductor thickness of internal layer 12, 18, 35µm
Plating thickness of through hole
(Thickness of PWB)
10µm≦
0.4 - 0.6t
15µm≦
0.8 - 1.2t
20µm≦
1.2 - 1.6t
The smallest hole diameter of FPH φ0.2≦
0.4 - 0.6t
φ0.25≦
0.8 - 1.2t
φ0.3≦
1.2 - 1.6t
The smallest space between walls of adjacent holes FPH - FPH : 0.4mm≦
FPH - PTH : 0.8mm≦
Number of layers 2, 4, 6, 8
Thickness of PWB 0.4 - 1.6mm

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