Construction
Process
Features
- It is capable of mounting of CSP with the pad 0.5mm pitch.
- Using prepreg with woven glass cloth, it offers the excellent performance in bending strength test and drop impact test.
- The stack-via (Structure) is able to produce by Filled Copper Plating.
- Higher density assembly is available by means of fine patterning technologies.
- Including FR-4 base materials, most conventional CCLs and pre-pregs are applied for this PWB for the required performances.
Applications
- Cellular phone, Digital still camera, CAM corder, IC card, PWB-Module, etc
Standard Specification
| Items | Standard spec. | ||
|---|---|---|---|
| External layer | Min. conductor width | 0.075mm | |
| Min. spacing of conductors | 0.075mm | ||
| Internal layer | Min. conductor width | 0.1mm (0.075) | |
| Min. spacing of conductors | 0.1mm (0.075) | ||
| Conductor thickness of external layer | 18µm | ||
| Conductor thickness of internal layer | 35µm | ||
| Plating thickness of through hole (Combination Type) | IVH | 15µm | |
| TH | 20µm | ||
| Via | Smallest land diameter of external layer | Laser-via | φ0.275 (φ0.25) |
| TH | φ0.6 | ||
| Smallest land diameter of internal layer | Laser | φ0.275 (φ0.25) | |
| IVH | φ0.5 | ||
| Smallest hole diameter | IVH | φ0.2 | |
| TH | φ0.25 | ||
| Number of layer | 4. 6. 8, 10 | ||
